Verizon NEBS Technical Updates
IntroductionThe Verizon NEBS Technical Update section provides the latest information about Verizon's NEBS Compliance programs. This page will present the most current technical information before it is applied to the Checklist and other NEBS Documents.
VZ.TPR.9211 , Vendor Power and Grounding Questionnaire, has been released to the industry. This TPR mandates the collection of data related to power fusing and operation. The data collected from this TPR shall be provided with all other NEBS documentation submitted for review.
VZ.TPR.9602 , Checklist for TMST ITL and Supplier Lab Audit, has been released to the industry. This TPR provides an audit checklist to be used when conducting audits for the TMST Certification Program. TMST Certification is based on an analysis of simulation software and verification testing.
Prepared by Todd Talbot, DMTS, Verizon NEBS Compliance and Quality Assurance - 1/29/2010
VZ.TPR.9307 , Qualification Requirements for Printed Board Assemblies Manufactured with Lead-Free Solder for use in Telecommunications Equipment Released to Industry.
Prepared by Todd Talbot, DMTS, Verizon NEBS Compliance and Quality Assurance - 12/03/2009
GR-1089-CORE, Issue 5: Accepted
The recent release of GR-1089, Issue 5 has been reviewed and accepted. Current test programs referencing Issue 4 may continue without upgrade until March 31, 2010. All test programs, thereafter, shall be based on Issue 5.
Prepared by: Howard Davis, DMTS, Verizon NEBS Compliance & Quality Assurance - 10/1/2009
GR-1089 – ESD Warning Labels
Electronic components are susceptible, and therefore sensitive, to ESD effects. Regardless of immunity performance during testing, products shall have ESD warning labels permanently affixed to the front of the chassis, in a visible area on the assembly. If cards can be inserted into both the front and rear of the chassis, ESD warning labels shall be placed on both the front and the rear of the chassis assembly. The faceplate of individual circuit cards/modules need not be labeled.
Prepared by: Howard Davis, DMTS, Verizon NEBS Compliance & Quality Assurance - 10/2/2009
ATCA Standards:Verizon takes exception to the slot-powering scheme defined by the Advanced Telecom Computing Architecture (ATCA) standards. The power allocated to each slot - 200 Watts per slot or up to 3200 Watts per shelf - is excessive and leads to high failure rates during NEBS testing. Conformance to NEBS requirements is a gating criterion for product approval. We evaluate each product on its merit and select the most cost effective solution to satisfy Verizon's business needs. NEBS compliance testing remains the only set of requirements that Verizon uses to evaluate products for safety, interference and functionality before deployment. For more information about Verizon's NEBS requirements, please download a copy of the TCG NEBS Compliance Checklist from this webpage.
Verizon's Clarifications to GR-63 Issue 3, March 2006 - 4/6/2006Verizon will require all testing and test reporting to be done to GR-63-CORE Issue 3 starting September 1st, 2006. Verizon continues to accept Issue 2 and will accept testing to Issue 3 with the clarifications listed below. We are currently revising the Verizon NEBS Clarifications document to reflect the new GR-63-CORE issue.
Section 4.2.2 Equipment Assembly Fire Tests
Section 4.2.2.1 Frame Level Fire Resistance Criteria
Section 4.2.2.2 Shelf Level Fire Resistance Criteria
Section 4.2.2.3 Smoke and Self -Extinguishment Criteria
GR-468-CORE Fiber Optic Component (FOC) testing requirement.All Active Fiber Optic Component testing to GR-468-CORE may be conducted at the component OEM, supplier, or equipment integrator's own laboratory facilities. Verizon no longer requires GR-468-CORE testing to be performed or witnessed by a Verizon-approved Fiber Optic Component (FOC) Independent Testing Laboratory (ITL). Verizon considers this standard to be very important for the verification and reliability of optoelectrical devices. Verizon reserves the right to examine GR-468-CORE test data from the OEM, supplier, or equipment integrator during the course of an equipment evaluation.
Use of Externally Mounted Ferrites - 5/4/2005Verizon does not accept the use of externally mounted ferrites on metallic cable interfaces for the purpose of EMI compliance. If used, ferrites shall form part of the products, not the cable, and shall be placed within the chassis enclosure.
Verizon's Guidelines for Physical Design of Next Generation Network Equipment - 8/26/2004This document provides guidance for manufacturers when designing equipment to meet Verizon's central office requirements. This document addresses our policies for the following items:Frame Depth and Aisle Spacing Use of Covers and Doors Thermal Management within COs HVAC Systems -- Air Conditioning Cooling -- Air Flow Direction and Temperature Rise Cooling -- Fan Noise Weight of Equipment and Impact on Floor Spacing and Loading Use of Overhead Cabling Use of Front-Access Connectors Cable Strain Relief and Circuit Pack Access Orientation of Fiber Connectors.
Document: SIT.NEBS.RQS.NPI.2004.018
Prepared by: Chuck Graff, Director, NEBS Compliance & Quality Assurance - 8/26/2004
Verizon's Statement on Telcordia GR-3108-CORE Issue 1, July 2004, Generic Requirements for Network Equipment in the Outside Plant (OSP) - 9/14/2004
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